IEEE COMCAS is a multidisciplinary conference that brings together a fascinating technical program led by international invited experts and a professional exhibition by the leading companies in the industry.
Session topics span from the chip to the system, covering the disciplines of:
Communications and Sensors
- Beyond 5G – Systems & Technologies
- AI, Machine Learning, Deep Learning in Communications and Sensors
- Big Data in Communication Networks
- MIMO & Space-Time Coding Technologies
- 5G systems & Millimeter Wave Propagation
- Cognitive Radio & Spectral Sharing
- Communications Security
- First Responder/Military Communications
- Green Communication
- Internet of Things
- Long Range Low Power Networks
- Micro/Pico/Femtocell Devices and Systems
- Modulation & Signal Processing Technologies
- On-Body and Short Range Communications
- Radio over Fiber & Optical/Wireless Convergence
- Sensor Networks and Technologies
- Software-Defined Radio & Multiple Access
Antennas, Propagation, and Scattering
- Antenna Theory and Design
- Smart Antennas, Beamforming and MIMO
- Wave Propagation and Channel Modeling
- Wave Scattering and RCS
- NanoEM, Plasmonics, and Applications
- Metamaterials, FSS and EBG
- EM Field Theory and Numerical Techniques
- EM Interference & Compatibility, SI
- Spectrum Management and Monitoring
- ELF, RF, μWave, mmW and THz Measurements
Signal Processing (SP) and Imaging
- Microwave Imaging and Tomography
- Acoustic/Sonar Imaging and Techniques
- Radar SP and Imaging, SAR, ATR
- MIMO SP for Radar
- Ground and Foliage Penetration Systems
- Signal Acquisition and Sensor Management
- DF, Emitter Location, Elint, Array Processing
- Target Detection, Identification and Tracking
- Data Fusion
- Time Domain and UWB SP
- AI, Machine Learning, Deep Learning in Signal and Image Processing
RF/MW Devices and Circuits, RFICs
- Solid-State Devices, RFICs
- μWave, mmW and Sub-mmW Circuits/Technologies
- Nano and THz Devices/Technologies
- Microwave Photonics
- Passive Components and Circuits
- Filters and Multiplexers
- Ferroelectrics, RF MEMS, MOEMS, and NEMS
- Active Devices and Circuits
- RF Power Amplifiers and Devices
- Tunable and Reconfigurable Circuits/Systems
- Analog/Digital/Mixed RF Circuits
- Circuit Theory, Modeling and Applications
- Interconnects, Packaging and MCM
- CAD Techniques for Devices and Circuits
- Emerging Technologies
- Internet of Things Devices
Microwave Systems, Radar, Acoustics
- Aeronautical and Space Applications
- RFID Devices/Systems/Applications
- Automotive/Transportation Radar & Communications
- Environmentally Sensitive (“Green”) Design
- UWB and Multispectral Technologies & Systems
- Emerging System Architectures
- Modelling Techniques for RF Systems
- Radar Techniques, Systems and Applications
- Sonar Systems and Applications
- Wireless Power Transfer & Energy Harvesting
- Terahertz Systems
- AI, Machine Learning, Deep Learning in Microwave, Radar, and Acoustic Systems
Biomedical Engineering
- Big Data in Medicine
- Artificial Intelligence, Machine Learning, Deep Learning
- Biomedical Systems and Applications
- Advances in Medical Imaging Technology
- Medical RF, MW & MMW Applications and Devices
- Medical Image Processing
- Acousto-Optic Technologies
- Novel Therapeutic Modalities
- Effects of RF and MW on Biological Tissues
Electronic Packaging & Thermal Management (P&TM)
- Chip, Package and PCB – Design, Advanced Materials and Technologies
- Chip & Board Level Assembly
- Advanced Packaging – 2.5D, 3D and Heterogenous Integration
- 3D Printing & Additive Manufacturing of Electronics
- Electro Photonics Packaging
- Adhesives, Molding & Encapsulation – Materials & Technologies
- Soldering & Brazing for Electronic Packaging
- Bio Medical Packaging
- Plating & Coating – Materials & Technologies
- Destructive and Non-destructive Testing
- Thermal Management in Electronic Systems – Methods, Modeling and Solutions
- Connectors, Cables & Routing
- Inspection – Technologies & Methods
- Reliability in Electronic Systems